About the KGD Packaging & Test Workshop
Hosted annually by the Die Products Consortium, the KGD Workshop focuses on semiconductor die products test, assembly, manufacturing, and business issues at the forefront of the microelectronics industry.
The workshop brings together technical experts, managers, and business development professionals from around the world for an interactive exchange of information on the latest developments in the die products industry. Over the years, workshop participants have helped to shape the evolution of KGD packaging from an early focus on specialized high performance systems to the successful low-cost solutions enabling today's portable world.
The 2008 KGD Packaging & Test Workshop will be held September 7-10, 2008 at the Embassy Suites Napa Valley.
Informative Technical Sessions
Participants learn about new die products technologies and market opportunities in highly focused technical sessions that address market forecasts, wafer level package reliability assessment, novel multi-chip packaging, wafer level test and burn-in, and much more. Take a look at our previous workshops, or read press coverage of the workshop, including a Japanese language article on the 2006 workshop.
Free Pre-Workshop Tutorials
Based on the success of the pre-workshop tutorials offered at the 2003 workshop, the technical committee has decided to make this a permanent feature of the workshop. The tutorials provide a comprehensive introduction to die products technologies with a focus the latest developments within the industry, and are valuable to attendees of all experience levels.
Exhibits of Die Products, Equipment, and Materials
The KGD Workshop features a highly focused exhibition showcasing suppliers of die products, equipment, materials, and supplies. A special reception on Monday evening in the exhibits area allows participants to make contacts with top suppliers in an informal and engaging atmosphere. More about exhibits...
Networking Opportunities
The workshop historically draws attendees from across North America, Europe, and Asia, and networking time is built into the workshop schedule. Complimentary receptions, luncheons, and a winery tour and dinner at a local Napa Valley winery provide opportunities to interact with peers from across the industry. Comments from previous participants.
Workshop Host
The workshop is hosted by the Die Products Consortium, a cooperative effort to promote the adoption of die products by electronic system manufacturers worldwide, and the industry’s leading source for information on die products. Visit the DPC website for more.