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The Die Products Industry Achievement award was presented to Mr. Tetsuya Onishi at the 8th Annual International KGD Packaging and Test Workshop held on September 9 through 12, 2001 in Napa, California.
The award recognizes Mr. Onishi’s unflagging efforts to expand worldwide markets for die products. Mr. Onishi is an expert in die product assembly technologies. He is based in Hong Kong and consults with companies in Asia-Pacific on technologies for die products assembly. Mr. Onishi’s extensive contacts in the region, where almost 50% of die products are assembled, has helped die products suppliers and researchers to develop a realistic picture of markets in the region. Mr. Onishi has developed and presented die products assembly technology tutorials in the region, arranged a technology tour of die products suppliers and manufacturers in the region, and was instrumental in recruiting presentations for the workshop from companies in the Asia-Pacific region. He is considered a key contact in the region by members of the Die Products Consortium.
Mr. Onishi received his B.S. degree in applied chemistry from Gifu University in Japan. He is currently an industry consultant on COB and COB technologies for Grand Joint Technologies which he established in 1997. Mr. Onishi is a member of the Institute of Electronics Information and Communications Engineers (EIC), Japan Institute of Electronics Packaging (JIEP), IMAPS and IEEE CPMT.