Previous Workshops: 2001 | 2002 | 2003 | 2004 | 2005 | 2006 | 2007
2002 Workshop Technical Program
Session 1: Die Products Industry Overview
Session Chairs: Paul Wakefield, National Semiconductor & Larry Gilg, Die Products Consortium
Opening Remarks
Sherb Bridges, National Semiconductor & Ara Talaslian, Hyperchip
Keynote Address PDF (3.5 MB)
Jan Vardaman, TechSearch International
Latest ASET Activity for System-Integration R & D in Japan PDF (1.1 MB)
Manabu Bonkohara, ASET
Die Products Markets in Europe PDF (1.7 MB)
John Campbell, Analog Devices
Die Products Markets in Asia/Pacific PDF (3.6 MB)
Tetsuya Onishi, GJ Technologies
Die Products Markets in the USA PDF (.4 MB)
Larry Gilg, Die Products Consortium
Session 2: Future Trends in the Portables World
Session Chairs: Jan Vardaman, TechSearch International & Tetsuya Onishi, GJ Technology
Analysis and Countermeasures for Thermal Expansion Under the Sub-micron LD Assembly by
Passive Alignment PDF (6.6 MB)
Tatsuo Nagamatsu, Arai Yoshiyuki, Toray Engineering Co. Ltd. Japan
Obsolescence: Compressed Product Life-cycles Create Opportunities for Commercial Die
Banking PDF (.7 MB)
Mike Roughton, GoodDie Network
Semiconductor Assembly Council (key performance indicators (yield, ppm, cycle time, etc.)
by package families) PDF (.2 MB)
Marla Cooper, Semiconductor Assembly Council
Laser Drilling of Microvias in silicon and Other Materials PDF (2.2 MB)
Dr. Adrian Boyle, Xsil
Session 3: Wafer Test Methods and Reliability Screens
Session Chairs: Jody Van Horn, IBM & Walid Ballouli, Motorola
Reducing KGD Test Cost Via “Prediction” Testing PDF (.2 MB)
Jerry Secrest, Secrest Research
True IDDQ Test and its Real-life Application PDF (.6 MB)
Hans Manhaeve, Q-Star Test NV
Ultra Fine Pitch Probing Technology PDF (1.7 MB)
Michinobu Tanioka, ASET
An Integrated Solution for KGD-- At-speed Wafer-level Testing and Wafer-level Burn-in PDF (.9 MB)
An-Hong (John) Liu, Yuan-Ping (Noty) Tseng, ChipMos
Alternatives for Producing Burned in and Tested Die PDF (1 MB)
Steve Steps, Aehr Test Systems
Wafer Level Test and Burn-In PDF (1 MB)
Steve Martinez, Tokyo Electron Unlimited
Cost Comparison between Sacrificial Metal Wafer Level Burn-in and Test (SM WLBT) vs.
Package Burn-In and Test PDF (.3 MB)
Walid Ballouli, Teresa McKenzie, Motorola
Session 4: Substrate and Module Level Test
Session Chairs: David Keezer, Ga Tech & Bruce Kim, ASU
Current Progress of a Low-cost Parallel Test Methodology for Passive Validations and
Interconnect Verifications for SoP Development PDF (.1 MB)
Kimberly Newman, University of Denver
An FPGA-Based Digital Logic Core for Embedded Test Applications PDF (.7 MB)
D.C. Keezer, J.S. Davis, Georgia Tech
A Real-world Application Used To Implement A True IDDQ Based Test Strategy (Facts and Figures) PDF (.6 MB)
Hans Manhaeve, Q-Star Test NV; Joseph S. Vaccaro, Loren Benecke & David Prystasz, Motorola
Session 5: Die Products Infrastructure
Session Chairs: Jim Rates, Chip Supply & Peter Opdahl, Ito America Corporation
Post – A novel, Lo-cost,Lo-stress, Flip-chip Technique For Existing Device PDF (.7 MB)
Elwyn Wakefield, Mintech Semiconductors, Ltd.
High Pin-count Ultrasonic Flip-chip Bonding and Plasma Cleaning Technology PDF (3.1 MB)
Ryota Furukawa, KME Panasonic
Development of Fine Pitch Flip Chip Bonding Technology for COF (Chip on Flex) PDF (.6 MB)
Mitsuru Chino, Misuzu Industries
Long Time, High Volume MCM and KGD Product Manufacturing Report PDF (2.3 MB)
Georg Meyer-Berg, Infineon
Solder Joint Reliability of Wafer Scale CSP Package PDF (1.5 MB)
Bob Sullivan, HDPUG
Session 6: Multichip Packaging
Session Chairs: Russ Wagner, Rockwell Collins & James Forster, Texas Instruments
Socrates – MCM based Symmetric High Bit Rate Digital Subscriber Line PDF (2.8 MB)
Georg Meyer-Berg, Infineon
Die Products Application Study PDF (2.3 MB)
Chris Windsor, Portelligent
Super High Density Interconnect PDF (.8 MB)
Mario Aguirre, Fujitsu Microelectronics America
Gold Dot Applications for the Portable World PDF (3.6 MB)
Bob Betz, Delphi Connection Systems
Quality Issues in Automotive Electronics PDF (.1 MB)
Wolfgang Mackrodt, Bosch Electronic
Concluding Remarks