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2003 Industry Award
DPC presents 2003 Industry Achievement Award to IBM test engineer
The Die Products Consortium (DPC) Industry Achievement Award is presented annually to an individual for exemplary efforts that enlarge the worldwide markets for die products. At the 10th annual KGD Packaging & Test Workshop, the DPC presented the award to Mr. Jody Van Horn of IBM, an industry expert in IC testing and reliability screening.
During his 25 year career at IBM, Mr. Van Horn has been responsible for developing solutions for bare die test and burn-in to provide known good die for the IBM mainframe and server business. He has also been engaged in developing test methods and reliability screens for multi chip package testing and, most recently, in developing tests for stacked die packages.
In the larger community, Mr. Van Horn has been project manager and a key contributor to a group of industry test experts who form multi-company project teams that collaborate to share data, analyze results and explore test strategies for next generation IC devices. His leadership and technical proficiency has proved invaluable in stimulating several collaborative projects among a group of leading industry test professionals.
