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2004 Industry Achievement Award
At the 11th annual KGD Packaging & Test Workshop in Napa, CA, the Die Products Consortium (DPC) presented the Industry Achievement Award to Mr. Jim Wolbert of Chip Supply, Inc. for his leadership in developing international standards for semiconductor die products. The DPC presents the award annually to an individual for exemplary contributions to enlarging the world-wide markets for die products.
Mr. Wolbert began his tenure at Chip Supply in 1983 as a Test Engineer. He became a Quality Engineer, then a Quality Manager and today holds the company's senior position in Quality Management.
Mr. Wolbert has been instrumental in working with the DPC and the international community to develop standards that address the unique needs of suppliers and users of bare die. As an advisor and technical expert, Mr. Wolbert participated on the project team that developed the CENELEC bare die standard, Data Requirements for Semiconductor Die, ES59008.
Currently, Mr. Wolbert is the convenor of a project team of TC 47 (the International Electrotechnical Commission's semiconductor devices technical committee) that has developed the international standard, IEC62258: Semiconductor Die Products. Part 1 of the standard, Requirement for Procurement and Use, forms the basis of the document and has been approved in balloting by the IEC member countries, and the standard will be officially adopted in 2005.
Mr. Wolbert is also leading the DPC's effort to complete an upgrade cycle to JESD 49: Procurement Standard for Known Good Die through a joint subcommittee of JEDEC JC-13 and JC-14 committees.
"Jim's technical understanding of the issues and management of the process in the USA, Europe and now internationally have directly led to standards emerging or being updated which will enhance the infrastructure for advanced applications of die products," said Larry Gilg, Managing Director of the DPC, "The industry owes Jim a long overdue vote of thanks."