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Keynote Address
Joe Adam, Skyworks, Inc.
Joe gives us a review of the future direction of the SiP business and related technologies required to
drive continued growth in SiP-based businesses, including a review of the long-term technology roadmaps and key challenges for the industry in assembly and test. He also discusses the impact of SiP on the electronics industry short and long term, and the key factors for future success in SiP-related businesses. The presenter provides an opportunity for questions and encourages discussion with the audience.
Joe Adam is Vice President Strategic Marketing at Skyworks Inc. where he is responsible for long range product strategy and new business development. His primary area of interest is the development of new business based on disruptive technologies. Prior to his present position he was the VP of Packaging and Test at Conexant where he developed a family of SiP technologies that established Conexant as the world leader in SiP technologies. He also co-chairs the ITRS and NEMI International Packaging Roadmap Working Groups.