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Advanced Packaging Trends in Europe
Francisco J. Ibañez, European Commission DG IST,
and Georg Meyer-Berg (presenter), Infineon Technologies
In the design and implementation of new ICT (Information and Communication Technology) products two major forces are present: Miniaturisation which implies the reduction of both technology feature size and system form factor; and the ability to intimately combine disciplines, so far considered separated. The concept of system integration is based on the convergence of these two trends. A suggested definition is the progressive combining of components to merge their functional and technical characteristics into a comprehensive interoperable system. The European research programme IST has identified system integration as a strategic area of work presenting technological challenges that require major R&D actions. Most of the advanced research activities in packaging are covered under the System Integration theme.
A number of running examples are presented ranging from different approaches to 3D integration to techniques for vacuum encapsulation of MEMS devices.
Finally, key elements considered important for future research in the area are identified.