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Plasma Surface Modification Technology for Underfill Process
Masaru Nonomura, Panasonic Factory Solutions Co., Ltd.
This presentation describes plasma surface modification technology as a method for good reliability of flip-chip packages.
The reliability of flip-chip packages depends on the underfill quality. Recently, package sizes are becoming small and thin, and also the gap between die and substrate is getting narrow. Attention has started to focus on the underfill process to meet the narrow gap and big die size of next stage flip-chip products.
Therefore, the surface modification process for flip-chip has become an increasingly significant technology. We report that a surface modification process using new plasma technology is a very attractive method for high velocity diffusing underfill process for narrow gap and big die size of next stage flip-chip.
Masaru Nonomura received his degree in Mechanical Engineering from Yamaguchi University of Japan in 1991. He currently works for the Fine Component & Device Mounting System Business Unit of Panasonic Factory Solutions Co., Ltd.