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Advanced COB Flip Chip Interconnect by ACF (Anisotropic Conductive Film)
Tatsuo Nagamatsu, Sony Chemicals Corporation
The current PDA market, and the high density cell phone requires a variety of high-end interconnects. Sony Chemicals has been a leader of advanced interconnect between Chip and organic substrate (Board) by ACF in the industry. Interconnect technology and its applications will be introduced in the presentation.
Tatsuo Nagamatsu graduated from the Tokyo International University of Economics in 1992, and then started from the Leadframe industry at Fuji Machinary. From 1996 to 2002, he worked for North America Marketing & Sales division of Toray Engineering Co Ltd. and focused on Flip Chip equipment and its processes. In 2002, he joined Sony Chemicals Corporation in 2002 and has been promoting Anisotropic Conductive Interconnect in the Flip Chip Industry.