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Low Cost High Speed Handling of Nano Components
Charles Gutentag, Tempo Electronics
"Die Shrink" in response to market demands has created logistic nightmares for customers who purchase bare die products for high-volume assembly use. Traditional means and methods for packing and handling packaged IC devices are unsuited for use with micro-sized bare die products assembled in automated factories where maximum throughputs and yields at lowest possible cost are primary concerns. This presentation sets forth root causes of problems in automated handling of vanishingly small bare die products and suggests solutions for implementation by all food chain participants.
Charles E. Gutentag is President of Tempo Electronics, North Hollywood, CA. Mr. Gutentag established Tempo Electronics in 1984 to develop and implement new technologies for packing, shipping and handling microelectronic bare die products. Previously, as President of Publication Engineers, he directed a series of groundbreaking programs in information science, including creation of SUR operating systems for implementation of Title 19 Medicaid program by the HEW Department in Washington, DC. He received his BSIE degree from Stanford University where he continued his studies in the Graduate School of Business. He holds memberships in several professional societies, including IEEE, EIA and SEMI, and is the author of ten patents in the fields of equipment, materials and processes for automated component logistics.