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Mounting Technology for Microchips in Cell Phones and Key Devices: Working to Reduce Substrate Costs
Tom Baggio, Panasonic Factory Solutions Co. of America
In a search for lower SMT assembly costs, manufacturing technologists have focused on Japanese mounting technology, with off-shored PCB’s and other products coming into use.
In the cell phone and key device industry, there has been a demand for 0402 chip mounting and even higher density mounting. Thus PCB land and solder resist registration requirements are very critical. As a result, manufacturers have been unable to obtain adequate reductions in substrate costs.
This paper introduces technology which utilizes the APC-60 system to reduce the costs of high density mounting substrates for microchips.
Currently engineering manager of the SMT and Selective Soldering Product Engineering Team for Panasonic Factory Solutions Co. of America, Tom Baggio has been a member of PFSA’s Product Engineering Team since 1995. Tom has contributed to various trade publications and was a contributing author to the book entitle “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies” published by Marcel Dekker, edited by Karl Puttlitz and Kathleen Stalter of IBM.
Prior to joining Panasonic, Tom worked with AT&T as a process and development engineer at the Montgomery Works’ Printed Circuit Board Fabrication facility. During his more than seven years of experience in PCB fabrication, Tom has been involved with practically all of the process steps in double-sided rigid and multilayer fabrication. While at AT&T, Tom co-developed a patented “Pre-Plate Cleaning Process” used in the dry film development process.
An active member of IPC and SMTA, Tom is currently a member of the IPC CAMX Shop Floor Communication Standards Committee as well as the IPC RFID Working Group. Tom received his bachelor’s degree in mechanical engineering from Illinois Institute of Technology in 1987.