Previous Workshops: 2001 | 2002 | 2003 | 2004 | 2005 | 2006 | 2007
SEMI E142 for Inkless Assembly and Traceability
Dave Huntley, Kinesys Software
There is a new standard (SEMI E142) that addresses the mapping of complex substrates (e.g. multi-project wafers, stacked packages, PCBs). The substrate maps include information about the individual and composite device bin codes, 2D matrix laser marks and substrate to substrate transfers. Wafer maps generated at wafer sort, are now in widespread use for assembly of devices without ink. As the cost advantages of final testing of devices in strip form become apparent, there will be a need to use strip maps for use by laser markers and singulation equipment.
Beyond these inkless assembly applications, there is a growing demand to trace individual devices through the assembly and test processes and into the field. This involves tracking the “from” and “to” XY coordinates when a device is transferred from e.g. a wafer to a strip. To identify the device in the field each device must be uniquely marked with e.g. 2D matrix laser mark, RFID or other compact marking technology. This device identifier can be used to recreate the conditions of manufacture including the exact location on the wafer.
SEMI E142 addresses both the inkless assembly and traceability requirements described above. This presentation will provide an introduction to the standard and how it might be applied.
Dave Huntley is the founder and president of KINESYS Software since 1992 with responsibility for software architecture, strategic marketing and business development. He has been involved with the development and marketing of the Assembly Line Production Supervisor (ALPS) product line. Dave has been involved with standards development since 1989. He is currently the co-chairman of the Sort Map task force at SEMI responsible for the Substrate Mapping standards (SEMI E142) for final manufacturing. Dave received a first class honours degree in Electrical and Electronic Engineering from Bristol University, UK.