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Challenges in Flip Chip Die Sorting and Handling
Gerald Steinwasser, Muhlbauer, Inc.
The growing number of bare die applications naturally requires faster and more efficient sorting systems. At the same time, the quality requirements have become more and more stringent (some automotive end users are calling for zero ppm!). The capabilities of such systems must combine speed and extreme vision inspection capabilities, which are challenged by on-the-wafer recognition, die handling (flipping), die placement accuracy, quality of output materials (carrier tape, surf tape, paper tape, waffle pack etc.), backside inspection, chip-out criteria, laser mark inspection, tomb stoning, sealing process and post-seal inspection.
Outlook and future trends to be discussed include:
- New requirements for inspection e.g. 2D Matrix code, 300mm wafer - larger dice.
- 3D inspection and overall higher accuracy.
- Special requirements for the handling and placement of (flexible) ultra-thin (5-30µm!) silicon.
- Flip chip's role in RFID applications.
Gerald Steinwasser is the General Manager of Mühlbauer, Inc. , a subsidiary of German Mühlbauer AG, and is responsible for its activities throughout the Americas. Gerald has been with the company for more than seven years and in recent years has been focusing mainly on bare die applications related to RFID and high-speed flip chip die sorting.
Prior to Mühlbauer, Gerald worked for a medical company, Gambro Healthcare, where he was responsible for the production of a highly automated injection molding department.
Originally from Germany, Gerald came to the U.S. the first time in 1988 through an exchange program with the German military. Gerald graduated from the University of the German Armed Forces in Munich with a degree in Aircraft & Aerospace Technology.