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RFID Die Assembly Technology Trends
Tetsuya Onishi, G.J. Technologies
RFID is becoming a quite important and common product for bare die. This presentation will show RFID bare die assembly technical trends. The following topics will be covered:
- RFID product trends,
- thin wafer technology,
- bare die assembly technology approach for RFID product sin Japan, and
- a teardown study.
Onishi Tetsuya is managing director of Grand Joint Technology Ltd (G.J. Tech). Formed in Hong Kong in 1997, Grand Joint Technology Ltd. (G.J. Tech) is a is microelectronics assembly process consulting company involved in Materials, Design, Process, and Analysis for COB, SMT, Packaging and LCD Modules.
Onishi Tetsuya received "The Die Products Industry Achievement award " at the 8th Annual International KGD Packaging and Test Workshop held on September 9 through 12, 2001 in Napa, California.