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SureCHIP™, The Ultimate in KGD Testing

Rick Pierson, International Rectifier

This paper looks at a KGD solution for Power Semiconductors that could be considered the ultimate in Die integrity and testing. SureCHIP™ is a process for testing die to a level and accuracy equivalent to a package part, which is not usually possible at wafer probe. Some of the limitation of testing at wafer probe are examined and alternative methods of KGD testing are explored and compared to the SureCHIP approach. Ultimately any solution comes down to a cost/benefit analysis and the correct approach is down to the application for which the die is intended.

Rick Pierson is the Business Development Manager for International Rectifier (IR) Die Sales in the Americas. He oversees the direct marketing support for customers, sales, vertical market groups and Die distribution in the Americas. Pierson joined IR in 1990 as an inside salesman supporting distribution. He advanced to IR’s Technical Assistance Center (TAC) as the Global Manager, responsible for providing technical support for all of the company’s product lines. He established Technical Assistance Centers in America, Europe and Asia before joining IR’s Die Sales Support Team in 2002.