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Silicon/Substrate Passive Integration
Alain Rougier, Philips Semiconductors
The SiP format is more and more considered as the right technology option to answer market requirements by complementing the single-chip (SoC) integration. It therefore enables, in a wide range of applications, to better meet the cost, size, performance and speed market requirements. However, as integrating multiple heterogeneous dies in a single package, SiP design and manufacturing provides new challenges to the semiconductor industry in terms of system design, reliable manufacturing and system integral cost. To better face those challenges, several technology enablers are mandatory such as advanced SiP Design environment and KGD approach. Furthermore, to actually meet both size and cost application requirements, advanced passive integration is becoming a critical technology enabler and a differentiator for leading-edge solutions.
Alain Rougier has degrees in Engineering and Business Administration. He worked for Schlumberger Industries from 1984 to 1995 as R&D Engineer , R&D Project leader and Digital Transmission Senior Marketing Product Manager. He then worked for Allied Signal from 1995 to 1996 as Marketing and Sales Support Manager ABS Europe. He has been with Philips since 1996 as Business and Marketing Manager for the Business Electronics division, Nokia Global Key Account Manager for the Components division and since 2003 as SiP Global Program Manager for the Semiconductors division.