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Wafer Level Die Marking and Substrate Mapping Standards
Aidan Cunningham, GSI Lumonics
GSI Group supplies laser systems used for IC traceability and product identification marking. A critical issue for integrated device manufacturers (IDMs) and outsourced packaging suppliers is the management and control of marking information and substrate mapping data. The IDM must be certain that accurate information is encoded onto the backside of the bare die for product ID, time/date stamp, lot ID, Pin one orientation, etc. The issue is traceability to the fab front end production process all the way back to the particular row and column on the wafer.
Despite the growing demand for comprehensive IC tracability, no widely used standards have emerged. GSIL will share their experience in delivering a new generation wafer level marking tool to the KGD industry and how wider use of substrate mapping standards could result in benefits to both the IC manufacturer and the tool supplier. Examples of how cost and lead times could be reduced while production flexibility enhanced with wider use substrate mapping standards.
Aidan Cunningham is applications and marketing manager for wafer marking systems at GSI Group. He has 16 years' experience in the development and implementation of laser marking systems for silicon wafer and IC package traceability in the semiconductor industry.