Previous Workshops: 2001 | 2002 | 2003 | 2004 | 2005 | 2006 | 2007
Standards for Procurement and Use of Die Devices
Mike Roughton, MGR Consultants
A proposal for an IEC international standard for die products led to the formation of a project team, PT47/62258 under the IEC Technical Committee TC47. The standard is known as “Semiconductor die products” which at present has six sections. In this presentation these sections will be described in more detail and at which stage of publication they have reached within the International environment.
The sections to be described will be Part 1: Requirements for procurement and use; Part 2: Exchange data formats: Part 3: Recommendations for good practice in handling, packing and storage; Part 4: Questionnaire for die users and suppliers ( a demonstration will be given); Part 5: Requirements for information concerning electrical simulation and Part 6: Requirements for information concerning thermal simulation. Particular emphasis will be placed on the work carried out in conjunction with ZVEI in Germany on the user/supplier questionnaire and how the system works.
Mike Roughton received the BSc in Metallurgy, Aston University in 1964. He was employed by Lucas Industries for 33 years and worked in various divisions from R & D, Automotive and Aerospace, where he worked on the development of microjoining, assembly and encapsulation techniques for the aerospace and automotive industries, and the development of wave soldering, cleaning and conformal coating techniques for aerospace PCB technology. He managed the JESSI T9 European project on the development of silicon hybrids (MCM-D).
He is currently a consultant in high density packaging, (MCM) and project manager of the European Commission IST funded Co-ordinated Action ENCAST previously the GOOD-DIE Network of Excellence.
He is a member of the Institute of Materials, IMAPS, and the CENELEC and IEC committees for standards on bare die, flip chip CSP etc.
His hobbies include tennis, golf, playing banjo in jazz band, and petanque.