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The Impact of KGD Probability on Stacked-Die Yield and Cost
Harry K. Charles, Jr., The Johns Hopkins University Applied Physics Laboratory
The cost and yield of known good die (KGD) have been major issues in multichip systems. In previous work, we studied conventional multichip modules (MCMs) assembled using chips selected from various KGD populations. Current work focuses on stacked die and their application in advanced MCMs. Investigations include yield and cost of the stacked die component as a function of the chip KGD probability. Stacking structures as well as the possibility of repair are discussed. Once characterized, the stacked component is then introduced into an MCM. The cost and yield of an n-chip MCM are investigated versus the KGD probability of both the individual die and the stacked component. A single layer planar MCM is compared to various combinations of stacked and single chips performing the same function. Module yield and cost versus the degree of stacking and repair are addressed. Also, stacking multichip single layer MCMs is considered.
Dr. Charles holds B.S. and Ph.D. degrees in Electrical Engineering from Drexel University and The Johns Hopkins University, respectively. He is a member of the Principal Professional Staff at The Johns Hopkins University Applied Physics Laboratory and Department Head of the Technical Services Department. Dr. Charles has worked for over 30 years in the microelectronics arena and is a specialist in electronic devices, systems, packaging, and reliability. His latest interests include multichip module design, fabrication and testing; advanced interconnect; biomedical instrumentation; and novel sensors based on meso , micro , and nano-scale technologies. He has published over 190 papers on electronic devices and packaging, along with nine patents and several pending patent applications.
Dr. Charles is a Fellow and former President of IMAPS - The Microelectronics and Packaging Society, a Fellow of the IEEE, and a past member of the Board of Governors of the IEEE's Components Packaging and Manufacturing Technology (CPMT) Society. He has received international recognition for his research, development, and teaching activities, including ISHM's Technical Achievement Award (1987), selection as Maryland's Distinguished Young Engineer (1989), The Johns Hopkins University's Outstanding Teaching Award (1992), the CPMT Board of Governors' Outstanding Service Award (1992), ISHM's Distinguished Service Award (1994), the IMAPS Daniel C. Hughes Memorial Award (1998), and numerous awards for best papers.