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System Integration Using System in Package Technology - The Need for Co-Design
Stan Mihelcic, LSI Logic
High performance system designs have continued to drive Moore's Law, requiring System on Chip providers to enable a roadmap of increased system integration, higher performance and lower cost solutions. In the 1990's, performance was the key driver in ASIC/SoC design. In the following decade, cost reduction and cost optimization have been the focus as product price erosion due to commoditization and fierce competition drive product roadmaps. As the cost of SoC design escalates with Moore's Law integration, alternative design architectures are being developed and/or enhanced. Along with alternatives including FPGA and platform ASIC (structured ASIC), SiP is starting to gain momentum. SiP is of growing interest due to its flexible design architecture, reduce design cycle time and the ability to reduce up front NRE's. As with SoC, successful SiP design solutions require system level co-design tools and methodologies to ensure robust performance, cost effective integration and predictable time to market solutions. This presentation will focus on the importance of SiP co-design and what system level design considerations need to be made to enable SiP as a truely viable system integration alternative to SoC.
Stan Mihelcic is director of Advanced Packaging and I/O Technology within the Technology Marketing organization for LSI Logic Corporation. He oversees the strategic packaging and I/O technology direction for ASIC/SoC products and direct marketing support for customers, sales, vertical market groups and design centers. Mihelcic joined LSI Logic in 1991 as a Product Engineer in the Canadian wafer fabrication facility. He advanced to LSI Logic's Quality and Reliability organization in Europe as Principal Quality Engineer, responsible for providing the technical support of the company's ASIC/ASSP product lines and working closely with the company's European customer base and LSI Logic's affiliate Design Centers. In 1999, Mihelcic joined the Technology Marketing organization managing the strategic marketing organization for advanced packaging technology.