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3D Packaging
Marcos Karnezos, STATS ChipPAC
The types of 3D packages are often characterized by how they are stacked, as chips, packages or passives. Stacked-Die Packages consist of bare die stacked and interconnected using wire bond and flip chip connections in one standard package.
Stacked-Packages consist of stacked, pre-tested packages or a mix of KGD and packages. They are interconnected using wire bond, flip chip or solder balls in one package. Multi-Package-Module combines stacking and side-by-side assembly of chips, packages and passives using wire bond, flip chip, surface mount assembly and passive cooling in one package.
The choice of the 3D packaging type is determined not only by the needs of the final product including footprint, profile and cost but the business model of procurement, assembly and ownership of the final module and the value added of the integration.
Examples of the types of 3D packages, their distinguishing characteristics and key enabling technologies will be discussed.
Dr. Marcos Karnezos serves as the Special Technology Advisor of STATS ChipPAC Ltd. Previously served as CTO of ChipPAC and VP of Technology at Signetics and ASAT. Has been 27 years in the electronics industry and has a PhD in Physics.