Technical Presentations
Pre-Workshop Tutorials
Tutorial #1: The Status and Future of Embedded Passive Components
Dr. Richard Ulrich, University of Arkansas
Abstract | Presentation
Tutorial #2: SiP Assembly Technology Trends
Vic Chang, SPIL R&D Division
Abstract | Presentation
Tutorial #3: Infrastructure Requirements for KGD
Jennifer Cheffings, Micron Technology
Abstract | Presentation
Session 1: Technology Overview & Business Issues
Opening Remarks
Jim Rates, Chip Supply, Inc.
Keynote Address
Ron Leckie, Infrastructure Advisors
Presentation
Market Overview
Jan Vardaman, Techsearch International, Inc.
Presentation
Die Products Assembly Trends From International Roadmaps, ITRS, iNemi and JISSO
Georg Meyer-Berg, Infineon Technologies
Presentation
The Application of SEMI E142 for Single Device Traceability
Dave Huntley, KINESYS Software
Abstract | Presentation
Panel Discussion - Adaptive Test
Session 2: Packaging Enabling Technologies
Challenges in Ultra-thin Die Handling
Gerald Steinwasser, Muhlbauer, Inc.
Abstract | Presentation
ACF/NCF for Flip-Chip Interconnection
Kazuya Matsuda, Hitachi Chemical Co. Ltd
Abstract | Presentation
Integrity of Solder Joint after Mechanical Shock in 300mm Wafer Level Fabricated Packaging
Se Young Jeong, Samsung Electronics
Abstract | Presentation
Solder Selections for Stacked Die and Low Temp Applications
Terence Collier, CV Inc.
Abstract | Presentation
KGD Assembly Using In Converted Au Stud Bumps
Roger Young, Fast Semiconductor
Abstract | Presentation
Plasma Etching Technology for Wafer Thinning Process
Kiyoshi Arita, Panasonic Factory Solutions Co., Ltd.
Michihiro Kojima, Panasonic Factory Solutions Co., Ltd.
Abstract | Presentation
Session 3: Infrastructure for Test
Multisite Test Strategy for SiP Mobile Technologies
Jim McEleney, Teradyne
Abstract | Presentation
Test Challenges for Mobile Application SiP
B.Y. Kim, Samsung Electronics Co.
Abstract | Presentation
Efficient SiP/POP Test Methodology
Young Dea Kim, Samsung Electronics Co.
Abstract | Presentation
2D and 3D Bumped Wafer Inspection
Dr. Carl Smets, ICOS Vision Systems
Abstract | Presentation
Critical Leak Rate Screen On Wafer Level For The Vacuum Lifetime Prediction In Nano Liter MEMS Packages
Wolfgang Reinert, Fraunhofer Institute for Silicon Technology
Abstract | Presentation
Increased Tester Capacity Provided by Multi-DUT Wafer Test with Pyramid Probes
Ken Smith, Cascade Microtech
Abstract | Presentation
Session 4: 3D and MultiChip Packaging Applications
3D Die Level Stacking and KGD Interdependence
Marc Robinson, Vertical Circuits, Inc.
Abstract | Presentation
3D/SiP Key Technologies
Tetsuya Onishi, GJ Technologies
Abstract | Presentation
Package on Package Development
Flynn Carson, STATS ChipPAC
Abstract | Presentation
Flex Integrated Modules
Bert Haskell, Staktek
Abstract | Presentation
Packaging, Function, Size, and Power Die/Package Implications for Ultra Mobile Consumer Platforms
Theodore Scardamalia, Portelligent, Inc.
Abstract | Presentation
Session 5: KGD Technologies
User Modes of a New ATE Interface to Serve KGD Needs
Peter Muhmenthaler, Infineon Technologies
Abstract | Presentation
Implementing Adaptive Test
Jeff Bibbee, Industry Consultant
Abstract | Presentation
3D Die Bond Wire Optimization in a 3D Design Environment
Gordon Jensen, CAD Design Services
Abstract | Presentation
Cost of Test Issues for RF SIP Circuits
Ken Harvey, Teradyne, Inc
Abstract | Presentation
Recent Advances in Low-Cost Multi-GHz Test
David Keezer, Georgia Institute of Technology
Abstract | Presentation
Session 6: Future Trends
Osmium Packaging Technology
Kyle Kirby, Micron Technology
Abstract | Presentation
Copper Pillar Well Methodology and Implementation in a VLP FB-DIMM
Peter Salmon, Peter C. Salmon, LLC
Abstract | Presentation
New Concept Paste Material for Improving PoP SMT Yield in Mobile Products
Tadashi Maeda, Panasonic Factory Solutions Co,. Ltd.
Kazuo Ishibashi, NOKIA Japan Co., LTD.
Abstract | Presentation
Supplying KGD: The CellularRAM Approach
Tom Weldon, Micron
Abstract | Presentation
Panel Discussion - Package-on-Package Business and Technology Trends