Osmium Packaging Technology

Kyle Kirby, Micron Technology

Micron's Osmium packaging technology, which borrows its name from one of the densest natural elements known to mankind, is poised to drive semiconductor packaging to the wafer level. Conventional packaging methods are reaching their technological limits, and electronics manufacturers are still demanding smaller, denser packages, improved performance, and lower system costs. Micron's Osmium packaging technology, with its potential to deliver extremely high-density, small-form-factor solutions, is the right technology at the right time. Osmium technology combines through-wafer interconnects, a redistribution layer, and wafer-level encapsulation—along with hundreds of supporting US patents and process engineering breakthroughs—and effectively extends the fabrication process to finished goods. This unique blend of leading wafer-level packaging technologies and IP promises to change the dynamics of semiconductor manufacturing and set a new standard for semiconductor packaging.

Kyle Kirby graduated in 1993 from Northern California's Humboldt State University with a Bachelor of Science in Industrial Technology. He joined Micron in 1994 pursuing a Manufacturing Engineer career, but ended up as a Technologist in the Research and Development department. He currently holds 20 US Patents with nearly 50 more in process at the USPTO. He has been with the Micron Advanced Packaging R&D group since its' inception and is currently Engineering Manager of the 3D stacking development team.