The Application of SEMI E142 for Single Device Traceability

Dave Huntley, Kinesys Software

There is a new standard (SEMI E142) that addresses the mapping of complex substrates (e.g. multi-project wafers, stacked packages, PCBs). The substrate maps include information about the individual and composite device bin codes, 2D matrix laser marks and substrate to substrate transfers. With this standard it is now possible to track single devices through the assembly process. Correlating final test results and field failures at the device level with the exact manufacturing conditions under which that device was manufactured as well as its precise location on the wafer, strip an tray on which it was processed, allows reduced cycle time, reduced scrap, rapid resolution of defect trends and increased yield. IC manufacturers have now started to implement E142 to realize these benefits. This trend will no doubt proliferate to the assembly and test sub-contractor community in time. In this presentation we will study an actual implementation of single device traceability using E142 and what the challenges were and lessons were learnt.

Dave Huntley is the founder and president of KINESYS Software since 1992 with responsibility for software architecture, strategic marketing and business development. He has been involved with the development and marketing of the Assembly Line Production Supervisor (ALPS) product line. Dave has been involved with standards development since 1989. He is currently the co-chairman of the Sort Map task force at SEMI responsible for the Substrate Mapping standards (SEMI E142) for final manufacturing. Dave received a first class honours degree in Electrical and Electronic Engineering from Bristol University, UK.