ACF/NCF for Flip-Chip Interconnection

Kazuya Matsuda, Hitachi Chemical Co.,Ltd

Anisotropic Conductive Film (ACF) is an interconnection material which consists of conductive particle and thermosetting adhesive resin. ACF has been widely used as an interconnection material for FOG (Flex on Glass) or COG (Chip on Glass) interconnection in FPD assembly.
This presentation will introduce the advanced technology of ACF for COB (Chip on Board) interconnection for semiconductor package and will cover NCF (Non conductive film) technology for advanced flip-chip interconnection using ultrasonic bonding process.

1994, Graduated from Tokyo Institute of Technology (Electronic chemistry).
1994-2006, Working with Hitachi Chemical for 12 years.
Now, senior researcher in charge of development for advanced interconnection material for flip-chip assembly in FPD and Semiconductor Package.